Product having through-hole and laser processing method

ABSTRACT

A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

RELATED APPLICATIONS

This application is a Divisional of U.S. application Ser. No.12/301,666, filed on Nov. 20, 2008, which is the U.S. National Phaseunder 35 U.S.C. §371 of International Application No. PCT/JP2007/060148,filed on May 17, 2007, which in turn claims the benefit of JapaneseApplication No. 2006-140967, filed on May 20, 2006, the disclosures ofwhich Applications are incorporated by reference herein.

TECHNICAL FIELD

The present invention relates to a product having a through-holeprocessed by a pulsed laser, and to a laser processing method.

BACKGROUND ART

In a wiring board such as a multilayered high-density wiring board,through-holes have conventionally been formed with a mechanical processusing a drill or the like. However, the mechanical processing is notreadily applicable under the recent circumstances in which the wiringdensity is increased, the diameter of though-hole is made smaller, andthe pitch between through-holes is also made smaller in the wiringboard. For the purposes of solving these problems and further improvingthe processing efficiency, there is a tendency to employ laserprocessing with a laser beam. In the case that a pulsed laser is used toform a through-hole, however, the through-hole has a tapered shape asshown in FIG. 10 (a), (b), causing a problem of defective plating forexample. Furthermore, scattered fragments, burrs and the like aregenerated as shown in FIG. 11 (a), (b), causing a problem of increase innumber of processes for rework, for example. In order to solve theseproblems, it is desired to develop a high-precision technique forforming through-holes by means of a pulsed laser. As for FIG. 10 (a),(b) and FIG. 11 (a), (b), a detailed description will be given inconnection with Examples.

In order to meet the requirements as described above, there have beenproposed laser processing methods improved in accuracy. For example,there is a proposed method in which a laser beam is applied to each ofthe surfaces of a workpiece in a process of forming a through-hole, soas to make the through-hole straight-like (approach to a right circularcylinder, or reduction in taper angle) (Patent Document 1). With thismethod, the diameters on the front and back sides of through-hole can bemade almost equal to each other. Thus, it becomes possible to reduce thetaper angle of through-hole and then to form a straight-likethrough-hole.

There is another proposed processing method that utilizes coherent laserlight reflected from a workpiece in a laser ablation process so as tomake it possible to readily form a through-hole having a reduceddifference between the diameters on its front and back sides (PatentDocument 2). With this method, the reflected light can increase theenergy density of light used for processing and change the shape ofthrough-hole, whereby making it possible to arrange through-holes at ahigh density.

Patent Document 1: WO99/59761 Patent Document 2: Japanese PatentLaying-Open No. 2000-77824 DISCLOSURE OF THE INVENTION Problems to beSolved by the Invention

According to the method disclosed in Patent Document 1 as describedabove, (1) the application of beams to both of the front and backsurfaces requires enormous efforts because of difficulty in positionalmatching between the front and the back surfaces; (2) the tapered shapepeculiar to the laser processing still remains whereby causing formationof a through-hole having non-straight-like sectional shape and a reduceddiameter in its middle portion; and (3) burrs are generated due to thelaser processing, whereby necessitating a process for removing theburrs.

Further, according to the method disclosed in Patent Document 2, (1) theuse of a photomask complicates the process of forming a hole; and (2)the process control is difficult because intensity of the reflected beamvaries depending on the material of workpiece and some materials are notreflective. Further, as described above, (3) burrs are generated due tothe laser processing, whereby necessitating a process for removing theburrs.

An object of the present invention is to provide a simplified laserprocessing method that can reduce the taper angle and can preventgeneration of burrs and attachment of scattered fragments, and thenprovide a product having a through-hole formed by using the laserprocessing method.

Means for Solving the Problems

A laser processing method of the present invention refers to aprocessing method for forming a through-hole in a workpiece by means ofa pulsed laser beam. The processing method includes the steps ofproviding a removable sacrifice layer on the workpiece, forming athrough-hole in the workpiece by the laser beam in a state where thesacrifice layer is provided, and removing the sacrifice layer from theworkpiece after the step of forming the through-hole.

By providing the sacrifice layer before the laser processing andremoving the same after the laser processing as described above, itbecomes possible to easily reduce the taper angle of through-hole due tothe laser processing. Therefore, it becomes possible to open asubstantially straight-like through-hole (taperless). Further, it alsobecomes possible to completely remove attached scattered fragments aswell as protruded portions such as burrs that are always generated inthe laser processing. The sacrifice layer may be made of the samematerial as or a material different from the material of workpiece.

The material of workpiece can be metal or organic polymer material, ortitanium or fluorine compound, and may have a porous structure. Thereason of this is that the above-described manufacturing method can beused to relatively easily open a straight-like through-hole in aworkpiece of any of the above-mentioned materials such as the fluorinecompound having the porous structure (in which it is usually difficultto form a straight-like through-hole).

The ablation threshold value of the sacrifice layer may be selected tobe not less than that of the workpiece. In virtue of this feature, it ispossible to ensure the effects achieved by providing the sacrificelayer. If the ablation threshold value of the sacrifice layer is smallerthan that of the workpiece, the preferable effects due to provision ofthe sacrifice layer is reduced because a large hole is formed in thesacrifice layer.

Further, the sacrifice layer may include a plurality of layers. Forexample, in the case that the ablation threshold value of workpiece isconsiderably large and the thickness of the film cannot be increased, itis possible to use a combined structure in which a sacrifice layer ofthe same material as that of the workpiece is provided as a top layerand a material having a relatively smaller ablation threshold value isprovided as an underlying layer. Furthermore, the material for thesacrifice layer may be selected from a wider variety of materialsdepending on other conditions.

It is preferable to carry out the processing so as to satisfy arelation: (θ×d^(0.68))/φ≦4.0 where φ (μm) denotes the diameter of laserbeam, θ (°) denotes the taper angle of through-hole and d (μm) denotesthe thickness of workpiece. The taper angle of through-hole depends onthe thickness of workpiece and the diameter of laser beam. Therefore,the processing conditions may be set to satisfy the above-describedrelation so that a straight-like through-hole can be obtained. Laserbeam diameter φ refers to the diameter at the front surface of the basefilm after the sacrifice layer is removed. Here, the above-describedexpression is derived from experimental data, and details thereof willbe described in connection with Example 2.

A product having a through-hole according to the present inventionrefers to a product having a through-hole formed by a pulsed laser. Thisproduct has a feature that (θ×d^(0.68))/φ≦4.0 is satisfied where φ (μm)denotes the diameter of pulsed laser, θ (°) denotes the taper angle ofthrough-hole and d (μm) denotes the thickness of product. Here, thetaper angle refers to an average taper angle determined form diametersat the front and rear surfaces of the hole on a supposition that thereis a common axis line, namely axisymmetry. By virtue of this feature, ina process of forming an electrically conductive portion in a thicknessdirection of a multilayer board that is recently required to have ahigher wiring density, for example, it becomes possible to preventdefective plating on the through-hole wall surface and form theconductive portion for highly reliable electrical connection.

Another product having a through-hole according to the present inventionalso refers to a product having a through-hole formed by a pulsed laser.This product has a feature that the through-hole is straight-like inshape. Here, the straight-like through-hole refers to aright-cylindrical through-hole. More specifically, the straight-likethrough-hole refers to a through-hole in the shape of a right cylinderor a through-hole whose wall surface does not include a curved portionin which the wall has an inwardly convex surface such that the diameterat one end of the through-hole becomes larger, as described hereinlater.In general, the wall surface of through-hole formed by a pulsed laser iscurved to be inwardly convex in a longitudinal cross section, causing aproblem such as defective plating in producing a wiring board, which isone factor of deterioration in reliability. In contrast, thestraight-like through-hole as described above can prevent defectiveplating of a wiring board or the like and can ensure an electricallyconductive portion for highly reliable electrical connection.

A still another product having a through-hole according to the presentinvention also refers to a product having a through-hole formed by apulsed laser. This product has a feature that the wall surface ofthrough-hole does not include a curved portion in which the wall has aninwardly convex surface such that the diameter at one end of thethrough-hole becomes larger. By virtue of this structure, it becomespossible to produce a highly reliable wiring board or the like.

All of the above-described products having their respectivethrough-holes can be produced without protrusions at peripheries ofopenings of the through-holes. By virtue of this feature, it becomeseasy to carry out a post process in fabrication of an electronic deviceon a multilayer wiring board or the like, for example. Here, theprotrusions are mainly formed by burrs.

Moreover, it is also possible to avoid attachment of scattered fragmentsdue to laser ablation on both surfaces where the through-hole is open.With this feature, it becomes possible to improve the reliability of themultilayer wiring board or the like, for example.

Effects of the Invention

The present invention can provide a product having a straight-likethrough-hole and a laser processing method that can reduce a taper angleand avoid burrs and attachment of scattered fragments on the product.Therefore, the invention can prevent defective plating on a through-holewall surface in a multilayer board and can contribute to supply ofhighly reliable multilayer boards and the like.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing a spatial distribution of energy density ina laser beam cross section.

FIG. 2 is a schematic diagram qualitatively showing a shape of anopening formed by a laser beam.

FIG. 3 is a diagram showing a simulation result illustrating the shapeof the opening that changes depending on increase in number of pulsedlaser shots.

FIG. 4 illustrates a definition of a taper angle.

FIG. 5 is a diagram showing a state of a through-hole opened by a pulsedlaser with a sacrifice layer being provided, in manufacturing a producthaving the through-hole in Example A of the present invention, where (a)shows an SEM image of a through-hole cross section and (b) shows aschematic diagram thereof.

FIG. 6 is a diagram showing a state of the through-hole in which thesacrifice layer in the state of FIG. 5 is removed, where (a) shows anSEM image of the through-hole cross section and (b) shows a schematicdiagram thereof.

FIG. 7 is a diagram showing a state of a through-hole opened by a pulsedlaser with a sacrifice layer being provided, in manufacturing a producthaving the through-hole in Example B of the present invention, where (a)shows an SEM image of a through-hole cross section and (b) shows aschematic diagram thereof.

FIG. 8 is a diagram showing a state of the through-hole in which thesacrifice layer in the state of FIG. 7 is removed, where (a) shows anSEM image of the through-hole cross section and (b) shows a schematicdiagram thereof.

FIG. 9 is a diagram showing a front surface of the product having thethrough-hole in Example A of the present invention, where (a) shows anSEM image of a through-hole cross section and (b) shows a schematicdiagram thereof.

FIG. 10 is a diagram showing a longitudinal cross section of a producthaving a through-hole formed by a titanium-sapphire laser (conventionalexample), where (a) shows an SEM image of the cross section and (b)shows a schematic illustration thereof.

FIG. 11 is a diagram showing a front surface of the product having thethrough-hole in FIG. 10, where (a) shows an SEM image of a cross sectionand (b) shows a schematic illustration thereof.

FIG. 12 is a diagram showing the dependency of the taper angle on thelaser beam diameter.

FIG. 13 is a diagram showing the dependency of the taper angle on thebase film thickness.

FIG. 14 is a diagram showing a sacrifice layer etc. of Example C inExample 3 of the present invention.

FIG. 15 is a diagram showing a sacrifice layer etc. of Example D inExample 3 of the present invention.

FIG. 16 is a diagram showing a base film of a comparative example inExample 3.

FIG. 17 is a diagram showing a processed diameter at a front surface ofa base film in Example D of the present invention.

FIG. 18 is a diagram showing a processed diameter at a rear surface ofthe base film in Example D of the present invention.

FIG. 19 is a diagram showing a processed diameter at a front surface ofa base film in a comparative example.

FIG. 20 is a diagram showing a processed diameter at a rear surface ofthe base film in the comparative example.

DESCRIPTION OF THE REFERENCE SIGNS

1 workpiece, 1 a sacrifice layer, 1 b base film, 5 through-hole, 10product having a through-hole, W through-hole wall surface, Wathrough-hole portion (wall) where the diameter expands as approachingthe front side, Wb straight-like through-hole portion (wall), Ws curvedportion (wall), Da diameter (larger diameter) at a front surface, Dbdiameter (smaller diameter) at a rear surface, d base film (product)thickness, t sacrifice layer thickness, 105 through-hole, 125 burr, 126scattered fragment.

BEST MODES FOR CARRYING OUT THE INVENTION

Embodiments of the present invention will now be described withreference to the drawings.

Principle of the Present Invention

The laser fluence (energy density) of a pulsed laser beam shows aspatial distribution in which it is high at a central portion and low ata peripheral portion, or generally shows a Gaussian distribution, asshown in FIG. 1. Therefore, supposing that O represents the centerposition of the beam and A₁ and A₂ represent positions where the laserfluence is equal to the threshold value of the ablation fluence, thereis the relation OA₁=OA₂ and the distribution has axisymmetry. A hole isdug by the ablation in the central side of the distribution where thelaser fluence is not less than the threshold value at which a workpieceis ablated. The energy density is higher as the position is closer tothe center. Thus, there is a tendency that a portion closer to thecenter is dug deeper. Accordingly, the wall surface of the hole isinclined as shown in FIG. 2. FIG. 2 is a cross section showing aworkpiece 1 immediately after a hole 5 is opened. After hole 5 is madethrough from the front surface to the rear surface of workpiece 1, eventhe peripheral edge of the laser beam having a lower fluence causesablation as long as the fluence is equal to or larger than the ablationthreshold value. Therefore, it is considered that, as the number ofpulse shots increases, the hole is further dug gradually and finally thetaper angle becomes 0° C. (straight). As a matter of fact, however, thisdoes not occur. Specifically, the taper angle does not approach zeroeven if the number of pulse shots is increased, and a certain taperangle remains.

Considering these phenomena, the present inventors reached an idea that“while the phenomena cause an inclined surface to be formed by initialshots, the laser fluence used for the ablation is lower at the inclinedsurface as compared with the case where the laser beam is applied to aflat surface; i.e., the amount of energy absorbed at the inclinedsurface is smaller and thus the energy applied to the ablationdecreases”. According to this idea, the laser fluence used for theablation decreases at the material of the inclined portion. At theinclined portion, a region absorbing energy less than the ablationthreshold value somewhat extends toward the center. Then, in the regionabsorbing energy less than the ablation threshold value, the hole is notdug even if the number of pulse shots is increased.

Regarding the case where pulsed laser processing by means of atitanium-sapphire laser is performed on a workpiece of fluorocarbonresin (porous structure), the above-described idea was verified bycalculations (simulations) and experiments. FIG. 3 shows the results ofcalculations based on the above-described idea, illustrating the shapeof a hole that is dug down during irradiation of a first shot to afourth shot of a pulsed laser beam. A wall surface having a gentle slopeis formed in a region located somewhat closer to the center relative toanother region that is near a peripheral edge of a laser beam crosssection where the fluence is less than the ablation threshold value. Ina region indicated by a circle S, there is formed the wall surface withthe gentle slope. The wall surface with the gentle slope is littleablated by the first to fourth shots, so that the gentle slope is heldas it is. Thus, near the tail of the fluence distribution, there is aportion where positions of the walls formed by the first to fourth shotsrespectively are unchanged and overlap each other. The overlappedportion little changes and remains even if the number of shots isincreased after the hole is opened through the workpiece. In summary,the following phenomenon could be confirmed through the calculations(simulations). There is caused the peripheral portion of hole where thetaper angle of a sectional shape of the hole is large. This portion of alarge taper angle corresponds to a through-hole wall portion Wadescribed in the following in connection with the results of experiments(FIG. 10 (a), (b)).

A hole was actually formed by means of a titanium-sapphire laser(conventional example), and a cross-sectional shape thereof was observedwith an SEM (Scanning Electron Microscope). FIG. 10 (a) is an SEM imageof the conventional example, and FIG. 10 (b) is a schematic illustrationthereof. In a through-hole 105 of a workpiece 101, a hole diameter Da atthe front surface that has been irradiated with the laser beam isconsiderably larger than a hole diameter Db at the rear surface. At awall surface Wa on the front side of through-hole 105, the diameterincreases as approaching the front surface. At a wall surface Wb on therear side of the through-hole, the diameter is substantially unchangedcontinuously and thus the shape is straight-like. There is a curvedportion Ws that is inwardly convex and overlaps wall surfaces Wa and Wb.The portion of wall surface Wa corresponds to the wall surface portionhaving a gentle slope in region S of FIG. 3, and expands like theopening end of a trumpet as approaching the front surface.

Regarding formation of a through-hole in a workpiece by using a pulsedlaser beam, the present inventors come up with a method according towhich a removable sacrifice layer is provided on a workpiece, athrough-hole is formed in the workpiece by the laser beam in the statewhere the sacrifice layer is provided, and then the sacrifice layer isremoved from the workpiece after the thorough hole is formed. Asdescribed above, the sacrifice layer is provided before the laserprocessing and is removed after the laser processing, and accordinglythe portion of Wa and further the portion of Ws can be mainly includedin the sacrifice layer and then can be removed. The magnitude ofthickness t of the sacrifice layer can be appropriately selecteddepending on the required dimensional accuracy of the through-hole.Consequently, it becomes possible to form a substantially straight-like(taperless) through-hole. Further, since the sacrifice layer is removedafter the laser processing, it is possible to completely removescattered fragments attached to the surface of the sacrifice layer aswell as burrs or the like protruding from the edge of the opening.

As for a method of providing a sacrifice layer on a surface of a subjectmaterial (workpiece), any method may be used as long as no interspace iscaused when a laser beam is applied. For example, on a workpiece of afluorocarbon resin (porous structure), a sacrifice layer of the samematerial can be placed by fusion bonding (bonding surfaces are fused andthen cooled so as to bond together). In the case of placing a sacrificelayer of (a Ti thin film+a fluorocarbon resin layer) on a workpiece of ametal such as Ti, the placing can be done with electrostatic force.Specifically, in the case of an ultrathin sheet, electrostatic force isgenerated therein and thus it is possible to simply put the sacrificelayer on the workpiece so as to adhere to each other. Alternatively, thesacrifice layer may be attached to the workpiece with an adhesive forexample.

The above-described method may be applied to a workpiece to fabricate aproduct having a through-hole as described below. In a product having athrough-hole of the present invention, the through-hole is provided bymeans of a pulsed laser, and taper angle θ of the through-hole isreduced to form a straight-like shape. Here, taper angle θ is defined astaper angle θ=Arctan {(0.5Da−0.5Db)/d} under the condition that there isthe axisymmetry as described above. Da and Db represent diameters ofopenings at the front and the rear surfaces, respectively. Further, drepresents the thickness of product 10, base film 1 b or workpiece 101.Each of opening diameters Da and Db is an average value obtained from atleast three times measurements. Thickness d is also similarly measured.Since taper angle θ of the through-hole of the present invention issmall, substantially the same result can be obtained even if radian isused as the unit of angle so as to use approximation of taper angle θ(radian)=(0.5Da−0.5Db)/d. Accordingly, in a process of forming anelectrically conductive portion in a thickness direction of a multilayerboard whose wiring density has been increasing recently, it becomespossible to prevent defective plating on the through-hole wall surfaceand form the electrically conductive portion for highly reliableelectrical connection.

With use of the above-described fabricating method, another producthaving a through-hole according to the present invention can have astraight-like through-hole. The definition of straight-like is the oneas described above. In still another product having a through-holeaccording to the present invention, the through-hole wall surface doesnot includes a curved portion that is inwardly convex at one end of thethrough-hole such that the diameter of the through-hole increases asapproaching the opening at that end. This through-hole specificallyrefers to a through-hole formed by a pulsed layer without includingcurved portion Ws in FIG. 10.

The product having the through-hole formed by the pulsed laser asdescribed above can have a straight-like through-hole. Therefore, in aprocess of forming an electrically conductive portion in a thicknessdirection of a multilayer board whose wiring density has been increasingrecently, for example, it becomes possible to prevent defective platingon the through-hole wall surface and obtain the electrically conductiveportion for highly reliable electrical connection. It is possible toachieve the structure that does not include protruded portions (such asburrs) at the edge of the through-hole opening and does not includeattachment of scattered fragments due to laser aberration.

EXAMPLES Example 1 1. Shape of Through-Hole

A hole was formed by a pulsed laser in workpiece 1 including base film 1b provided with sacrifice layer 1 a. The thickness of fluorocarbon resinof base film 1 b was 150 μm and the thickness of fluorocarbon resinlayer of sacrifice layer 1 a was 30 μm. While base film 1 b andsacrifice layer 1 a were made of the same material in this Example, theymay be made of different materials respectively as described above.

FIGS. 5 and 6 illustrate a process of forming a through-hole of ExampleA of the present invention. FIG. 5 (a), (b) show a state wherethrough-hole 5 is formed by a pulsed laser in workpiece 1 in whichsacrifice layer 1 a of fluorocarbon resin of 30 μm thickness is providedon base film 1 b of fluorocarbon resin of 150 μm thickness. FIG. 5 (a)shows an image of an SEM cross section, and FIG. 5 (b) shows a schematicillustration thereof. According to these diagrams, the portion of wallsurface Wa where the diameter expands as approaching the front surfaceis included in sacrifice layer 1 a of thickness t and is removedafterwards. FIG. 6 (a) shows an SEM image of base film 1 b or product 10after sacrifice layer 1 a is removed, and FIG. 6 (b) shows a schematicillustration thereof. Product 10 having the through-hole or base film 1b thus includes the through-hole formed with straight-like wall surfaceWb. While the taper angle in the state of FIG. 5 (a), (b) was 5.1°, thetaper angle is reduced to 3.0° in the state of FIG. 6 (a), (b).

With product 10 including the straight-like through-hole, in a processof forming an electrically conductive portion in a thickness directionof a multilayer board whose wiring density has been increasing recently,it is possible to prevent defective plating on the through-hole wallsurface and form the electrically conductive portion for highly reliableelectrical connection. Further, it is also possible to provide theproduct not including burrs and scattered fragments, as described indetail hereinlater.

FIGS. 7 and 8 illustrate a process of forming a through-hole of ExampleB of the present invention. Example B of the present invention isbasically the same as Example A of the present invention. Specifically,FIGS. 7 (a) and (b) are each a diagram showing a state wherethrough-hole 5 is formed by means of a pulsed laser in workpiece 1 inwhich sacrifice layer 1 a of fluorocarbon resin of 30 μm thickness isprovided on base film 1 b of fluorocarbon resin of 150 μm thickness.FIG. 7 (a) is an SEM cross-sectional image, and FIG. 7 (b) is aschematic illustration thereof. According to FIG. 7 (a), the portion ofwall surface Wa where the diameter expands as approaching the frontsurface is included in sacrifice layer 1 a of thickness t and is removedafter the through-hole is formed. FIG. 8 (a) shows an SEM image of basefilm 1 b or product 10 having the through-hole after sacrifice layer 1 ais removed, and FIG. 8 (b) is a schematic illustration thereof. Basefilm 1 b or product 10 having the through-hole is thus formed bystraight-like wall surface Wb. While the taper angle in the state ofFIG. 7 (a), (b) was 5.1°, the taper angle in the state of FIG. 8 (a),(b) was 3.0°. This product having the through-hole provides theadvantages as described above.

In contrast, in the conventional example as shown in FIG. 10 (a), (b),there is wall surface Wa having a large taper angle in the portioncorresponding to the periphery of the laser beam and located on thefront side of through-hole 105. Further, there is curved portion Ws thatis inwardly convex between straight-like portions Wb and Wa andoverlapping these portions. Wall surface Wa having a large taper angleand corresponding to the periphery of the laser beam as described abovecorresponds to the portion of the wall surface where the hole is notfurther dug and the wall portions overlap each other while the first tofourth shots are applied as shown in FIG. 3.

Because of the presence of portion Wa having a large taper angle,straight-like portion Wb and curved portion Ws overlapping both of theother portions, defectiveness is caused in plating for forming anelectrically conductive portion and thus the reliability of the wiringboard is deteriorated. Examples A and B of the present invention causeno defectiveness in plating since portion Wa of a large taper angle iscompletely removed from the through-hole as shown in FIG. 6 (a), (b) andFIG. 8 (a), (b).

2. Burrs and Scattered Fragments

FIGS. 9 (a) and (b) each illustrate the front surface of the producthaving the through-hole of Example A of the present invention (the frontsurface of FIG. 6 (a), (b)). In contrast, FIGS. 11 (a) and (b) eachillustrate the front surface of the product having the through-hole inFIG. 10 (a), (b). In each of FIGS. 11 and 9, (a) shows an SEM image of athrough-hole cross section, and (b) shows a schematic illustrationthereof. As shown in FIG. 11 (a), (b), burrs 125 are formed on theperipheral edge of the opening at the front surface of through-hole 105,and scattered fragments 126 are also attached thereon. In contrast, inExample A of the present invention, there is no scattered fragments orburrs on the front surface of base film 1 b or product 10 having thethrough-hole after the sacrifice layer is removed.

Example 2 Relation Between Taper Angle, Laser Diameter and Thickness ofWorkpiece

In the case that a through-hole is formed with a sacrifice layerprovided, the taper angle is strongly influenced by laser beam diameterφ and thickness d of the base film (subject material) (although thetaper angle even in the case of forming a through-hole with no sacrificelayer is also influenced by above-described φ and d, it is influenced indifferent manners). FIG. 12 is a diagram showing a dependency of taperangle θ (°) on laser diameter θ (μm), and it is seen that the taperangle (°) is proportional to the laser diameter φ (μm). FIG. 13 is adiagram showing a dependency of taper angle θ (°) on base film thicknessd (μm), and it is seen that the taper angle (°) is proportional to thebase film thickness {d (μm)}^(−0.68).

Expression (1)=(θ×d^(0.68))/φ is provided here. Then, expression (1) canbe regarded as the one indicating the magnitude of taper angle θconsidering base film thickness d and laser diameter φ (i.e., correctedwith base film thickness d and laser diameter φ). Experimental datacorresponding to the plots in above-described FIGS. 12 and 13 aresummarized in Table 1 and Table 2. Table 1 shows the results regardingthe process of forming a through-hole in a base film (workpiece orsubject material) of PTFE (polytetrafluoroethylene), and Table 2 showsthe results regarding the process of forming a through-hole in a basefilm of Ti.

TABLE 1 (workpiece: PTFE) sacrifice φ: laser layer d: thickness beam θ:taper value of present/ of base film diameter angle expression absent[μm] [μm] [°] (1) Invention's present: 180 20 0.5-2.5 0.85-4.27 Example1 PTFE Invention's present: 60 20 1.9-3.1 1.54-2.51 Example 2 PTFEInvention's present: 120 20 1.4-1.8 1.82-2.33 Example 3 PTFE Invention'spresent: 180 30 1.5-3.5 1.71-3.99 Example 4 PTFE Invention's present:180 50 3.5-6.0 2.39-4.10 Example 5 PTFE Comparative absent 30 20  8-134.04-5.05 Example 1 Comparative absent 120 20 3.6-5.7 4.67-7.40 Example2 Comparative absent 180 20 2.5-3.7 4.27-6.32 Example 3 Comparativeabsent 240 20 2.2-2.6 4.57-5.40 Example 4 note 1: expression (1) = (θ ×d^(0.68))/φ

TABLE 2 (workpiece: Ti) sacrifice φ: laser layer d: thickness beam θ:taper value of present/ of base film diameter angle expression absent[μm] [μm] [°] (1) Invention's present: 20 28.5  5-21 1.35-5.65 Example 6one Ti layer Invention's present: 20 28.5  4-12 1.08-3.23 Example 7 twoTi layers Comparative absent 20 26.7 21-55  6.03-15.80 Example 5 note 1:expression (1) = (θ × d^(0.68))/φ

In each of Invention's Examples 1 to 5 shown in Table 1, PTFE that isthe same material as that of the base film is used for the sacrificelayer for the following reasons. It is considered that it is natural touse the sacrifice layer of the same material as that of the base film tobe processed. In addition, even if it is attempted to select anothermaterial, it is difficult to find a material having a higher ablationthreshold value than the very high ablation threshold value of the PTFEof the workpiece. In Table 2, there are shown the case where onesacrifice layer of Ti that is the same material as the material Ti ofthe workpiece is provided (Invention's Example 6) and the case where twosacrifice layers are provided (Invention's Example 7). The fluorocarbonresin has an ablation threshold value of 0.44 J/cm² and Ti has anablation threshold value of 0.05 J/cm².

Referring to the values of expression (1) in Table 1 and Table 2, in thecase that the value of expression (1) is not more than 4.0, taper angleθ itself is small, and thus it can be said that the processed producthas a taperless through-hole or straight-like through-hole. In someembodiments of the present invention, the value of not more than 4.0 ofexpression (1) is derived from FIGS. 12 and 13 and the data in Table 1and Table 2.

Example 3 Formation of Through-Hole in Ti Film

In Example 3 of the present invention, laser processing was performed toprovide a through-hole in a Ti base film of 20 μm thickness. FIGS. 14and 15 show respective structures each including sacrifice layer 1 a andbase film 1 b in Example C and Example D of the present invention. InExample C of the present invention, PTFE of 60 μm thickness was used forsacrifice layer 1 a. In Example D thereof, a combination of Ti of 5 μmthickness and PTFE of 60 μm thickness was used for sacrifice layer 1 a.In consideration of the fact that the sacrifice layer of a porous PTFEcauses scattering and transmission of incident light and thus the effectof the sacrifice layer is lessened, Ti (5 μm) was used as a shield forpreventing transmission of the light. Then, such a Ti base film with nosacrifice layer as shown in FIG. 16 is used as a comparative example.Table 3 and Table 4 show laser parameters and the like for Examples Cand D of the present invention and the comparative example.

TABLE 3 Laser Parameters and Material (Invention's Examples C, D) laserwavelength 800 nm laser repetition frequency 10 Hz laser pulse width 120fs laser energy 54-0.35 μJ workpiece (base film) Ti (99.5%), thickness:20 μm, purchased from Nilaco Corporation (model number: Ti-453212)

TABLE 4 Laser Parameters and Material (Comparative Example) laserwavelength 800 nm laser repetition frequency 10 Hz laser pulse width 160fs laser energy 31-2.65 μJ workpiece (base film) Ti (99.5%), thickness:20 μm, purchased from Nilaco Corporation (model number: Ti-453212)

Table 5 shows the result for the through-hole in Example C of thepresent invention in the case that the laser energy is 30 μJ or 10 μJ.Table 6 shows the result for the through-hole in Example D of thepresent invention in the case that the laser energy is 15 μJ, 10 μJ or 8μJ. It is seen from Table 5 and Table 6 that there is a tendency thatthe taper angle is smaller as the laser energy is smaller, and theeffect of providing two layers (Ti/PTFE) as the sacrifice layer can beconfirmed to some degree.

TABLE 5 (Invention's Example C) sacrifice layer energy (μJ) 30 10 PTFEprocess diameter (μm) 37-49 22-26 (PTFE front surface) taper angle (°)3-9 2-5 workpiece energy (μJ) 30 10 Ti process diameter (μm) 19-25 15-19(20 μm, Ti front surface) process diameter (μm) 15-20 10-12 (20 μm, Tirear surface) taper angle (°)  6-21  5-11

TABLE 6 (Invention's Example D) sacrifice energy (μJ) 15 10 8 layerprocess diameter (μm) 29-34 22-26 20-22 PTFE (PTFE front surface) taperangle (°) — — — workpiece energy (μJ) 15 10 8 Ti process diameter (μm)16-20  9-15  7-10 (20 μm, Ti front surface) process diameter (um) 10-134-7 4 (20 μm, Ti rear surface) taper angle (°)  7-11  5-12 4-8

TABLE 7 (Comparative Example) energy (μJ) 31 23 process diameter (μm) 80(max)-77 (min) 44-42 (20 μm, Ti front surface) process diameter (μm)24-19 26-21 (20 μm, Ti rear surface) taper angle (°) 55-53 29-23

TABLE 8 (Comparative Example) energy (μJ) 10 5 2.65 process diameter(μm) 40-38 36-34 34-33 (20 μm, Ti front surface) process diameter (μm)21-19 19-15 18-15 (20 μm, Ti rear surface) taper angle (°) 22-26 26-2224-21

On the other hand, Table 7 and Table 8 show the results for thethrough-holes in the comparative examples. For example, when respectiveresults concerning the laser energy of 10 μJ are compared with eachother, it is seen that the taper angles of Examples C and D of thepresent invention are particularly reduced and improved to be as smallas ½ to ¼ compared with those of the comparative examples. Whenrespective results concerning the laser energy of approximately 30 μJare compared with each other, the taper angle of Example C of thepresent invention is 6 to 21° as shown in Table 5, while the taper angleof the comparative example of Table 7 is 55 to 53°. Thus, it is possibleto confirm the remarkable effect of improvement in Example C of thepresent invention. Further, the taper angle in Table 8 is 26 to 22° forthe laser energy of 10 μJ to 5 μJ. In Example D in Table 6, the taperangle is 8 to 4° for the laser energy of 8 P. Therefore, it can be saidthat dramatic improvements are achieved in forming a taperlessthrough-hole in any of Examples of the present invention.

FIGS. 17 and 18 show respective process diameters at the front and rearsurfaces of the base film (Ti) regarding the laser energy of 15 μJ inExample D of the present invention. FIGS. 19 and 20 show respectiveprocess diameters at the front and rear surface of the base film (Ti)regarding the laser energy of 5 μJ in the comparative example. As seenfrom Example 1 as well, in the case that the sacrifice layer is notused, burrs are formed and scattered fragments are also found near theperipheral edge of the hole at the front surface of the base film. Interms of the circularity of hole as well, it is seen that thecomparative examples are inferior to Example D of the present invention.

While embodiments and examples of the present invention have beenexplained above, the embodiments and examples of the present inventiondisclosed above are provided merely by way of illustration and example,and the scope of the present invention is not limited to theseembodiments of the invention. The present invention includes, in itstechnical scope, all of laser processing methods according to which aportion influenced by the inclined surface generated in the process ofapplying initial pulsed laser shots still remains in the subsequentprocess of applying shots, and is included in the sacrifice layer evento a smaller extent. The scope of the present invention is defined byclaims and includes all modifications in meaning equivalent to and inthe scope of the claims.

INDUSTRIAL APPLICABILITY

The present invention can provide a product having a straight-likethrough-hole and a laser processing method that can reduce a taper anglein the through-hole and avoid burr and attachment of scattered fragmentson the product. Therefore, the invention can prevent defective platingon a through-hole wall surface in a multilayer board and contribute tosupply of highly reliable multilayer board or the like.

1-4. (canceled)
 5. A product having a through-hole made by a pulsedlaser, wherein (θ×d^(0.68))/φ≦4.0 is satisfied where φ (μm) denotes adiameter of said pulsed laser, θ (°) denotes a taper angle of saidthrough-hole and d (μm) denotes a thickness of said product.
 6. Aproduct having a through-hole made by a pulsed laser, wherein saidthrough-hole is straight-like in shape.
 7. A product having athrough-hole made by a pulsed laser, wherein a wall surface of saidthrough-hole has no curved portion that is inwardly convex at one end ofsaid through-hole such that the diameter of said through-hole expands asapproaching an opening at said one end.
 8. The product having thethrough-hole according to claim 7, wherein no protruded portion ispresent at a peripheral edge of an opening of said through-hole.
 9. Theproduct having the through-hole according to claim 7, wherein bothsurfaces where said through-hole opens have no attachment of scatteredfragments due to laser ablation.